URASET adhesives are clear, two-part urethane resin systems, which combines good handling characteristics with excellent cured properties. Their low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in Medical Industries such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
UB-21, UB-55 and UB-70 are used
for medical applications by our customers and have passed the stringent toxicity
requirements.
URASET ADHESIVES |
UB-21 |
UB-21FC |
UB-55 |
UB-70 |
Resin |
PART-A |
PART-A |
PART-A |
PART-A |
Hardener |
PART-B |
PART-B |
PART-B |
PART-B |
Mix ratio by weight (Part-A/Part-B) |
58/100 |
58/100 |
67/100 |
73/100 |
Mix Viscosity @ 25°C, cp |
825 |
825 |
700 |
600 |
Pot life (100 grams) @ 25°C, hr |
1 |
5 to 7 min (5 grams) |
1 |
1 |
Recommended Cure |
2 hrs @ 100°C |
2 hrs @ 60°C |
2 hrs @ 100°C |
2 hrs @ 100°C |
Alternate Cure |
1-2 days @ 25°C |
1-2 days @ 25°C |
1-2 days @ 25°C |
1-2 days @ 25°C |
TYPICAL CURED PROPERTIES |
||||
Color |
Clear |
Clear |
Clear |
Clear |
Specific Gravity |
1.1 |
1.1 |
1.1 |
1.1 |
Hardness, Shore |
A-82 |
A-82 |
D-55 |
D-70 |
Lap shear strength to aluminum, psi |
1200 |
1200 |
1800 |
2100 |
Water Absorption (immersion @ RT), % |
0.04 (24 hr) |
0.04 (24 hr) |
0.11 (7 days) |
0.1 (7 days) |
Glass Transition Temperature, °C |
4 |
4 |
9 |
12 |
Dielectric Constant @ 1 kHz |
3.6 |
3.6 |
3.6 |
3.4 |
Dissipation Factor @ 1 kHz |
0.04 |
0.04 |
0.04 |
0.02 |
Volume Resistivity, ohm-cm |
2x1013 |
>1014 |
>1013 |
>1013 |
DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.