Download in PDF Format

HOME
APPLICATIONS
PACKAGING
PRODUCTS
CONTACT


THERMALLY CONDUCTIVE ADHESIVES

 

EPOXIBOND Thermally Conductive Adhesives are designed for demanding needs for die-attach; heat sink bonding and surface mount applications. They rapidly transfer heat, eliminate hot spot, and increase the operating efficiency of most devices. Its low shrinkage minimizes risk of damage to fragile components. Typical applications include fabricating heat sinks, bonding semiconductors, transistors to heat sinks for wireless communications, satellite transmission and circuit board manufacturing.

 

EPOXIBOND

EB-401-1

EB-402-1

EB-403-1

EB-404-1

EB-407

EB-425

EB-485

EB-486

Hardener

NA

NA

NA

NA

EH-9

EH-6

EH-9

PART-B

Mix ratio by weight

(Epoxibond/Hardener)

ONE PART

ONE PART

ONE PART

ONE PART

100/4

100/5

100/3.5

100/100

Viscosity @ 25°C

cps

Paste

Paste

Paste

35,000

Paste

Paste

Paste

Paste

Storage Temperature

 

25°C or below

-40°C or below

25°C or below

25°C or below

25°C

25°C

25°C

25°C

Pot life (100 grams)

 

½ hr @ 80°C

3 days @ 25°C

½ hr @ 80°C

<10 minutes @ 80°C

2 hr @ 25°C

>4 hr @ 25°C

½ hr @ 25°C

2 hr @ 25°C

Shelf Life

 

4 months @ 25°C

12 months @-40°C

4 months @ 25°C

4 months @ 25°C

2 years  @ 25°C

2 years @ 25°C

2 years  @ 25°C

2 years  @ 25°C

Recommended Cure

 

1 hr @100°C+1 hr @ 150°C

2 hr @ 125°C

1 hr @100°C + 1 hr @ 150°C

1 hr @125°C

½ hr @100°C

2 hr @100°C+2 hr @ 150°C

2 hrs @70°C

24-48 hrs @ 25°C

Alternate Cure

 

30 minutes @ 150°C

15 minutes @ 150°C

30 minutes @ 150°C

30 minutes @ 150°C

24-48 hrs @ 25°C

4 hrs @ 125°C

24 hrs @ 25°C

1 hr @ 100°C

TYPICAL CURED PROPERTIES

Color

 

Black

Black

Black

Red

Black

Black

Black

Black

Specific Gravity

 

1.66

2.14

2.1

1.6

2.3

2.3

2.3

1.7

Hardness

Shore D

90

91

90

90

94

94

90

86

Thermal Conductivity

W/m°K

1.1

1.6

1.8

1.1

1.53

1.53

1.53

1.0

Lap shear strength

psi

2620

2200

2620

3400

2400

2400

2400

2800

Water Absorption

(24 hours @ 25°C)

%

0.1

0.12

0.1

0.09

0.14

0.007

0.01

0.12

Glass Transition Temperature

°C

140

145

132

130

77

165

120

80

Coefficient of Thermal Expansion

10-6/°C

31.5

24.5

27.5

39

27

29

26

60

Service Temperature Range

°C

-55°C to 180°C

-55°C to 180°C

-55°C to 180°C

-55°C to 165°C

-55°C to 120°C

-55°C to 180°C

-55°C to 150°C

-55°C to 120°C

Dielectric Strength (3mm thickness)

Volts/mil

450

460

460

400

460

460

430

420

Dielectric Constant

@ 1 kHz

5.2

6.1

5.3

4.73

5.9

6.19

5.8

5.3

Dissipation Factor

@ 1 kHz

0.01

0.02

0.04

0.01

0.008

0.015

0.01

0.08

Volume Resistivity

Ohm-cm

1x1015

2x1015

6x1015

3x1015

7x1013

1x1016

2x1015

1x1015

DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.