THERMALLY CONDUCTIVE ADHESIVES
EPOXIBOND Thermally Conductive Adhesives are designed for demanding needs for die-attach; heat sink bonding and surface mount applications. They rapidly transfer heat, eliminate hot spot, and increase the operating efficiency of most devices. Its low shrinkage minimizes risk of damage to fragile components. Typical applications include fabricating heat sinks, bonding semiconductors, transistors to heat sinks for wireless communications, satellite transmission and circuit board manufacturing.
EPOXIBOND |
EB-401-1 |
EB-402-1 |
EB-403-1 |
EB-404-1 |
EB-407 |
EB-425 |
EB-485 |
EB-486 |
|
Hardener |
NA |
NA |
NA |
NA |
EH-9 |
EH-6 |
EH-9 |
PART-B |
|
Mix ratio by weight (Epoxibond/Hardener) |
ONE PART |
ONE PART |
ONE PART |
ONE PART |
100/4 |
100/5 |
100/3.5 |
100/100 |
|
Viscosity @ 25°C |
cps |
Paste |
Paste |
Paste |
35,000 |
Paste |
Paste |
Paste |
Paste |
Storage Temperature |
|
25°C or below |
-40°C or below |
25°C or below |
25°C or below |
25°C |
25°C |
25°C |
25°C |
Pot life (100 grams) |
|
½ hr @ 80°C |
3 days @ 25°C |
½ hr @ 80°C |
<10 minutes @ 80°C |
2 hr @ 25°C |
>4 hr @ 25°C |
½ hr @ 25°C |
2 hr @ 25°C |
Shelf Life |
|
4 months @ 25°C |
12 months @-40°C |
4 months @ 25°C |
4 months @ 25°C |
2 years @ 25°C |
2 years @ 25°C |
2 years @ 25°C |
2 years @ 25°C |
Recommended Cure |
|
1 hr @100°C+1 hr @ 150°C |
2 hr @ 125°C |
1 hr @100°C + 1 hr @ 150°C |
1 hr @125°C |
½ hr @100°C |
2 hr @100°C+2 hr @ 150°C |
2 hrs @70°C |
24-48 hrs @ 25°C |
Alternate Cure |
|
30 minutes @ 150°C |
15 minutes @ 150°C |
30 minutes @ 150°C |
30 minutes @ 150°C |
24-48 hrs @ 25°C |
4 hrs @ 125°C |
24 hrs @ 25°C |
1 hr @ 100°C |
TYPICAL CURED PROPERTIES |
|||||||||
Color |
|
Black |
Black |
Black |
Red |
Black |
Black |
Black |
Black |
Specific Gravity |
|
1.66 |
2.14 |
2.1 |
1.6 |
2.3 |
2.3 |
2.3 |
1.7 |
Hardness |
Shore D |
90 |
91 |
90 |
90 |
94 |
94 |
90 |
86 |
Thermal Conductivity |
W/m°K |
1.1 |
1.6 |
1.8 |
1.1 |
1.53 |
1.53 |
1.53 |
1.0 |
Lap shear strength |
psi |
2620 |
2200 |
2620 |
3400 |
2400 |
2400 |
2400 |
2800 |
Water Absorption (24 hours @ 25°C) |
% |
0.1 |
0.12 |
0.1 |
0.09 |
0.14 |
0.007 |
0.01 |
0.12 |
Glass Transition Temperature |
°C |
140 |
145 |
132 |
130 |
77 |
165 |
120 |
80 |
Coefficient of Thermal Expansion |
10-6/°C |
31.5 |
24.5 |
27.5 |
39 |
27 |
29 |
26 |
60 |
Service Temperature Range |
°C |
-55°C to 180°C |
-55°C to 180°C |
-55°C to 180°C |
-55°C to 165°C |
-55°C to 120°C |
-55°C to 180°C |
-55°C to 150°C |
-55°C to 120°C |
Dielectric Strength (3mm thickness) |
Volts/mil |
450 |
460 |
460 |
400 |
460 |
460 |
430 |
420 |
Dielectric Constant |
@ 1 kHz |
5.2 |
6.1 |
5.3 |
4.73 |
5.9 |
6.19 |
5.8 |
5.3 |
Dissipation Factor |
@ 1 kHz |
0.01 |
0.02 |
0.04 |
0.01 |
0.008 |
0.015 |
0.01 |
0.08 |
Volume Resistivity |
Ohm-cm |
1x1015 |
2x1015 |
6x1015 |
3x1015 |
7x1013 |
1x1016 |
2x1015 |
1x1015 |
DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.