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SILICONE ENCAPSULANTS

SILCAST compounds are designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material has a very good flexibility with excellent electrical properties and high temperature resistance. It may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal. 

SILCAST

SC-440

SC-450

SC-452

SC-454M-6

SC-550

SC-550LV

Mix ratio by weight (Resin/Hardener)

100/100

100/10

100/3

100/3

100/100

100/100

Mix Viscosity @ 25°C, cp

600-800

800-1000

30,000

4000-6000

3500

800

Pot life (500 grams) @ 25°C, hr

2

1

>8

1

>8 hrs

>8 hrs

Recommended Cure

½ hr @ 125°C

1 hr @ 100°C

2-3 hr @ 65°C

24 hr @ 25°C

1 hr @ 100°C

1 hr @ 100°C

 Alternate Cure

1 hr @100°C

24 hrs @ 25°C

48 hr @ 25°C

-

½  @ 125°C

½  @ 125°C

TYPICAL CURED PROPERTIES

Color

Clear

Clear

Red

Red

Gray

Gray

Specific Gravity

1.05

1.05

2.14

2.0

1.40

1.40

Hardness, Shore A

40

38

70

55

30

30

Thermal Conductivity, W/m°K

-

-

1.4

1.6

0.5

0.5

Tensile Strength, psi

800

800

600

650

>250

>250

% Elongation

100

100

70-80

70-80

>200

>200

Service Temperature

-55°C to 200°C

-55°C to 200°C

-65°C to 220°C

-65°C to 250°C

-55°C to 200°C

-55°C to 200°C

Flammability

Self-extinguishing

Self-extinguishing

Meets UL-94V0

Meets UL-94V0

UL-94VO approved

UL-94VO approved

Dielectric Constant @ 1 kHz

2.6

2.6

5.6

5.8

2.9

2.9

Dissipation Factor @ 1 kHz

0.001

0.001

0.01

0.01

0.02

0.02

Volume Resistivity, ohm-cm

2x1015

2x1015

8x1014

6x1016

2x1016

2x1016

 

 

DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.