SILICONE ENCAPSULANTS
SILCAST compounds are designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material has a very good flexibility with excellent electrical properties and high temperature resistance. It may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal.
SILCAST |
SC-440 |
SC-450 |
SC-452 |
SC-454M-6 |
SC-550 |
SC-550LV |
Mix ratio by weight (Resin/Hardener) |
100/100 |
100/10 |
100/3 |
100/3 |
100/100 |
100/100 |
Mix Viscosity @ 25°C, cp |
600-800 |
800-1000 |
30,000 |
4000-6000 |
3500 |
800 |
Pot life (500 grams) @ 25°C, hr |
2 |
1 |
>8 |
1 |
>8 hrs |
>8 hrs |
Recommended Cure |
½ hr @ 125°C |
1 hr @ 100°C |
2-3 hr @ 65°C |
24 hr @ 25°C |
1 hr @ 100°C |
1 hr @ 100°C |
Alternate Cure |
1 hr @100°C |
24 hrs @ 25°C |
48 hr @ 25°C |
- |
½ @ 125°C |
½ @ 125°C |
TYPICAL CURED PROPERTIES |
||||||
Color |
Clear |
Clear |
Red |
Red |
Gray |
Gray |
Specific Gravity |
1.05 |
1.05 |
2.14 |
2.0 |
1.40 |
1.40 |
Hardness, Shore A |
40 |
38 |
70 |
55 |
30 |
30 |
Thermal Conductivity, W/m°K |
- |
- |
1.4 |
1.6 |
0.5 |
0.5 |
Tensile Strength, psi |
800 |
800 |
600 |
650 |
>250 |
>250 |
% Elongation |
100 |
100 |
70-80 |
70-80 |
>200 |
>200 |
Service Temperature |
-55°C to 200°C |
-55°C to 200°C |
-65°C to 220°C |
-65°C to 250°C |
-55°C to 200°C |
-55°C to 200°C |
Flammability |
Self-extinguishing |
Self-extinguishing |
Meets UL-94V0 |
Meets UL-94V0 |
UL-94VO approved |
UL-94VO approved |
Dielectric Constant @ 1 kHz |
2.6 |
2.6 |
5.6 |
5.8 |
2.9 |
2.9 |
Dissipation Factor @ 1 kHz |
0.001 |
0.001 |
0.01 |
0.01 |
0.02 |
0.02 |
Volume Resistivity, ohm-cm |
2x1015 |
2x1015 |
8x1014 |
6x1016 |
2x1016 |
2x1016 |
DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.