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TG - Series non silicone thermal compounds are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products. They offer better stability for a longer life cycle with high thermal conductivity (3.7 W/m°K) and low thermal resistance (0.014 °C-in2/W).
|
PRODUCT |
|
TG-61 |
TG-62 |
TG-63 |
TG-64 |
TG-65 |
|
Viscosity |
|
Thixotropic Paste |
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|
Specific Gravity |
@25°C |
2.4 |
2.7 |
2.3 |
1.7 |
1.7 |
|
Color |
|
Blue |
Blue |
Gray |
Black |
Black |
|
Evaporation @200°C, 24 hrs |
% WT |
0.6 |
0.5 |
0.6 |
0.2 |
0.2 |
|
Thermal Conductivity |
W/m°K |
0.8 |
2.6 |
2.7 |
3.7 |
2.3 |
|
Thermal Resistance |
°C-in2/W |
0.03 |
0.02 |
0.019 |
0.014 |
0.02 |
|
Dielectric Strength |
V/mil |
310 |
392 |
405 |
290 |
300 |
|
Volume Resistivity |
Ohm-cm |
1.5x1014 |
2.1x1014 |
1.8x1014 |
2.8x1012 |
4.8x1012 |
|
Operating Temperature Range |
|
-55°C to 200°C |
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DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.