Download in PDF Format

HOME
APPLICATIONS
PACKAGING
PRODUCTS
CONTACT

 

MICROELECTRONIC LIQUID ENCAPSULANTS

SEMICONDUCTOR PACKAGING ■ FLIP CHIP UNDERFILL ■ GLOB TOP

FEATURES

APPLICATION

Product

Pot Life

Sp. Gravity

Viscosity @ 25°C (cps)

Cure Schedule

Coefficient of Thermal Expansion (10-6/°C)

Tg. (°C)

Operating Temperature Range

Thermal Conductivity (W/m°K)

Volume Resistivity (Ohm-cm)

-40°C

To

25°C

25°C to

120°C

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Fast flow rate cavity fill

-Chip-On-Board

 

-Semiconductor Packaging

M-3022

>8 hrs @ 25°C

1.69

50,000

4 hrs @ 150°C

25

32

146

-55°C to 150°C

0.7

3x1014

M-3023

>8 hrs @ 25°C

1.76

39,000

30 min @ 100°C+

2 hrs @ 165°C

22

25

151

-55°C to 150°C

0.75

1x1015

M-3024

>8 hrs @ 25°C

1.82

48,000

4 hrs @ 150°C

22

24

152

-55°C to 150°C

0.8

2x1014

M-3025

>8 hrs @ 25°C

1.75

24,000

1 hr @ 80°C+

2 hrs @ 150°C

24

28

148

-55°C to 150°C

0.75

3x1015

M-3026

>8 hrs @ 25°C

1.82

85,000

30 min @ 100°C+

2 hrs @ 165°C

20

22

156

-55°C to 150°C

0.8

1x1014

M-3028

>8 hrs @ 25°C

1.77

100,000

4 hrs @ 150°C

 

22

25

158

-55°C to 150°C

0.75

3x1014

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Fast flow rate

 

-Very good adhesion

Flip Chip Underfill (under 2 mils)

M-3110

2 days @ 25°C

1.76

5100

1 hr @ 100°C+

1 hrs @ 150°C

26

34

130

-40°C to 150°C

0.75

2x1015

M-3112

>8 hrs @ 25°C

1.82

32,000

1 hr @ 80°C+

2 hrs @ 150°C

23

30

143

-55°C to 150°C

0.8

7x1014

M-3116

>8 hrs @ 25°C

1.73

14,000

2 hrs @ 150°C

22

29

150

-55°C to 150°C

0.75

1x1015

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Thixotropic

 

-Very good adhesion

Glob Top Encapsulants for high and low profile

GT-3221

>8 hrs @ 25°C

1.72

280,000

1 hr @ 80°C+

2 hrs @ 150°C

25

37

124

-55°C to 150°C

0.75

>1014

GT-3222

>8 hrs @ 25°C

1.67

90,000

1 hr @ 100°C+

2 hrs @ 165°C

27

39

146

-55°C to 150°C

0.7

1x1015

GT-3224

>8 hrs @ 25°C

1.76

130,000

1 hr @ 100°C+

2 hrs @ 165°C

23

32

156

-55°C to 150°C

0.75

4x1014
                           

 

FEATURES

APPLICATIONS

Product

Shelf Life

Pot Life

Sp. Gravity

Viscosity @ 25°C (cps)

Cure Schedule

Coefficient of Thermal Expansion

 (10-6/°C)

Tg (°C)

Operating Temp. Range

Thermal Conductivity (W/m°K)

Volume Resistivity (Ohm-cm)

-40°C to 25°C

25°C to 120°C

Ø   Low thermal expansion

Ø   Good moisture resistance

Ø   Excellent thermal cycle performance

Ø   One and two components

Ø   Very good adhesion

Ø     Substrate Attach

Ø     Lid Seal

Ø     SMD Attach

Ø     Stacking component

Ø     Die Attach applications

o   Chip-On-Board

o   LED

o   TCP

o   MCM-L,C, & D

EB-316TM

1 year @ 25°C

45 Min @25°c

1.35

Paste

1 hrs @ 160°C

77

-

109

-55°C to 150°C

0.5

3x1013

EB-315

1 year @ 25°C

90 Min @25°c

1.8

Paste

1 hrs @ 175°C

25

40

182

-55°C to 230°C

0.7

2x1015

EB-350-3T

4 months @ 25°C

20 Min @80°C

1.5

Non-Sag Paste

1 hrs @ 150°C

32

41

120

-55°C to 150°C

1.0

1x1015

EB-402-1

1 year @

-40°C

12 Min @ 125°C

2.14

>250,000

2 hrs @ 125°C

24

33

145

-55°C to 150°C

1.8

2x1015

EB-403-1

1 year @

-40°C

30 Min @80°C

2.1

Non-Sag Paste

1/2 hr @ 150°C

28

38

145

-55°C to 150°C

1.75

6x1015

EB-404-1

4 months @ 25°C

10 Min @80°C

1.6

40,000

1/2 hr @ 150°C

39

51

130

-55°C to 150°C

1.2

3x1015

EB-414-1

1 year @

-40°C

12 Min @ 125°C

2.1

20,000

1/2 hr @ 150°C

35

48

124

-55°C to 150°C

1.6

2x1015

EB-407

1 year @

25°C

2 hrs @ 25°C

2.3

Paste

1/2 hrs @ 100°C

27

60

77

-40°C to 120°C

1.3

7x1015

EB-425

1 year @

25°C

>4 hrs @ 25°C

2.3

>250,000

2 hrs @ 100°C +

2 hrs @ 150°C

29

39

165

-55°C to 200°C

1.7

1x1016

EB-415-1

1 year @

-40°C

12 Min @125°C

2.2

>250,000

1/2 hr @ 160°C

24

35

142

-55°C to 150°C

1.9

2x1015

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.