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ELECTRICALLY CONDUCTIVE ADHESIVES
EPOXIOHM, electrically conductive adhesives are typically used for die-attach, chip bonding, cold -soldering, and other microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure for 1000 hours at 150°C.
|
Product |
Features |
Shelf Life |
Viscosity (CP-51spindle) cps |
Cure Schedule |
Specific Gravity |
Lap Shear Strength (AL-AL) psi |
Tg
(°C) |
CTE (10-6/°C)
Below Tg |
Volume Resistivity Ohm-cm |
|
TWO COMPONENTS |
|||||||||
|
EO-21 |
General purpose, RT or slightly elevated heat cure |
1 year @ 25°C |
32,400 @ 5 rpm |
1 hr @ 100°C |
3.0 |
1100 |
68 |
62 |
0.0004 |
|
EO-21M-5 |
General purpose, RT or slightly elevated heat cure |
1 year @ 25°C |
1000 @ 5 rpm |
1 hr @ 100°C |
3.0 |
1100 |
85 |
62 |
0.0006 |
|
EO-23 |
Low viscosity, RT or slightly elevated heat cure |
1 year @ 25°C |
5000 @ 50 rpm |
1 hr @ 100°C |
2.5 |
1100 |
68 |
62 |
0.0008 |
|
EO-24 |
Low viscosity, fast cure - die, LED and substrate attach |
1 year @ 25°C |
2800 @ 50 rpm |
5 minutes @ 150°C |
3.0 |
1200 |
80 |
56 |
0.0005 |
|
EO-30M-1 |
Flexible, RT cure or slightly at elevated heat cure |
1 year @ 25°C |
Smooth Past |
1 hr @ 100°C |
3.2 |
1700 |
50 |
77 |
0.001 |
|
EO-32 |
Snap cure, 2-3 days work life @ 25°C |
1 year @ 25°C |
42,000 @ 5 rpm |
15 minutes @ 150°C |
3.9 |
2100 |
117 |
69 |
0.0001 |
|
EO-38 |
Long work life, easy to dispense |
1 year @ 25°C |
23,500 @ 5 rpm |
5 minutes @ 150°C |
3.9 |
1700 |
108 |
47 |
0.0002 |
ONE COMPONENT (BELOW 25°C STORAGE TEMPERATURE) |
|||||||||
|
EO-81 |
Low viscosity, RT storable - Die attach adhesive |
1 months @ 25°C |
12,000 @ 5 rpm |
1 hr @ 180°C |
2.9 |
2100 |
82 |
54 |
0.0003 |
|
EO-84 |
Screen printable - hybrid chip adhesive |
1 months @ 25°C |
22,000 @ 5 rpm |
1 hr @ 150°C |
3.5 |
2000 |
103 |
49 |
0.0001 |
|
EO-97M2 |
Easy to dispense, minimal tailing - Die attach applications |
1 month @ 25°C |
47,000 @ 5 rpm |
1 hr @ 150°C |
3.2 |
1300 |
82 |
56 |
0.0005 |
|
ONE COMPONENT (BELOW -40°C STORAGE TEMPERATURE) |
|||||||||
|
EO-82 |
Snap cure - die-attach adhesive |
1 year @ -40°C |
57,000 @ 5 rpm |
15 minutes @ 150°C |
3.95 |
2200 |
120 |
57 |
0.0002 |
|
EO-91 |
Low viscosity, cure @ RT or slightly elevated heat cure |
1 year @ -40°C |
2100 @ 100 rpm |
2 hrs @ 65°C |
2.8 |
1750 |
64 |
38 |
0.0007 |
|
EO-93 |
Low viscosity, Snap cure - die attach applications |
1 year @ -40°C |
38,200 @ 5 rpm |
½ hr @ 150°C |
3.5 |
1400 |
60 |
36 |
0.0002 |
|
EO-94 |
Fast cure - Die, LED and substrate attach |
1 year @ -40°C |
40,000 @ 5 rpm |
½ hr @ 150°C |
3.4 |
1000 |
122 |
45 |
0.0002 |
|
EO-95 |
Low viscosity version of EO-94 |
1 year @ -40°C |
20,000 @ 5 rpm |
½ hr @ 150°C |
3.4 |
1000 |
122 |
45 |
0.0002 |
|
EO-96 |
Low viscosity, fast cure - Die, LED and substrate attach |
1 year @ -40°C |
14,000 @ 5 rpm |
15 minutes @ 150°C |
3.9 |
1400 |
100 |
63 |
0.0004 |
|
EO-98 |
Low viscosity, snap cure - Die attach applications |
1 year @ -40°C |
70,000 @ 5 rpm |
5 minutes @ 150°C |
3.9 |
1400 |
92 |
63 |
0.0002 |
|
EO-98M |
Lower viscosity version of EO-98 |
1 year @ -40°C |
37,500 @ 5 rpm |
5 minutes @ 150°C |
3.9 |
1400 |
90 |
63 |
0.0002 |
DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.